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  d a t a sh eet objective speci?cation 2000 sep 04 discrete semiconductors kmi22/1 rotational speed sensor for extended air gap application and direction detection m3d391
2000 sep 04 2 philips semiconductors objective speci?cation rotational speed sensor for extended air gap application and direction detection kmi22/1 features digital current output signal digital offset compensation extended air gap zero speed capability direction detection digital output protocol three level output signal additional digital input pin wide temperature range insensitive to vibration emc resistant tolerant to positioning. description the kmi22/1 is a sensitive rotational speed sensor for the application with ferrous gear wheels (1) . the sensor consists of a magnetoresistive sensor element, a driver ic in bimos technology, a digital signal conditioning ic in highly integrated cmos technology and a ferrite magnet. the digital two wire current output carries a signal proportional to the rotational speed of a gear wheel plus a digital protocol. pinning (1) the sensor contains customized integrated circuits. usage in hydraulic brake systems and in systems with active brake control is forbidden. for all other applications, higher temperature versions of up to 150 c are available on request. caution do not press two or more products together against their magnetic forces. pin description 1v cc 2v in 3v - handbook, halfpage 123 mbk766 fig.1 simplified outline (sot477b). quick reference data symbol parameter min. typ. max. unit v cc dc supply voltage 0 12 18 v i ccl current output signal low 5.6 7.0 8.4 ma i ccph current output signal protocol high 11.2 14 16.8 ma i ccsh current output signal speed high 22.4 28 33.6 ma v in input voltage pin 2 0 - 100 % v cc d sensing distance 0 to 4 0 to 4.5 - mm f r operating tooth frequency 0 - 2500 hz t amb ambient operating temperature - 40 - +85 c
2000 sep 04 3 philips semiconductors objective speci?cation rotational speed sensor for extended air gap application and direction detection kmi22/1 limiting values in accordance to the absolute maximum rating system (iec 60134). note 1. with r l =43 w the device is continuously protected against wrong polarity of dc supply voltage (v cc ) to gnd; see fig.12. characteristics t amb =25 c; v cc = 12 v; d = 2.1 mm; f t = 2 khz; test circuit: see fig.12; r l =43 w ; sensor positioning: see fig.13; gear wheel: module 2 mm; material 1.0715; unless otherwise speci?ed. symbol parameter conditions min. max. unit v cc dc supply voltage between leads 1 + 3 t amb = - 40 to +85 c; r l =43 w ; see fig.12 018v v in input voltage pin 2 t amb = - 40 to + 85 cv - v cc v t stg storage temperature range - 65 +150 c t amb ambient operating temperature - 40 +85 c t sld soldering temperature t < 10 s - 260 c output short-circuit duration v cc to gnd (see fig.12) continuous short-circuit duration pin 2 to pin 1 and pin 2 to pin 3 continuous wrong polarity t amb = - 40 to +65 c; r l =43 w ; note 1 continuous symbol parameter conditions min. typ. max. unit i l current output low t = - 40 to +85 c; see figs 6 and 8 5.6 7 8.4 ma i ph current output protocol high t = - 40 to +85 c; see figs 6 and 8; 11.2 14 16.8 ma i sh current output speed high t = - 40 to +85 c; see figs 6 and 8; 22.4 28 33.6 ma t r output signal rise time c l = 100 pf; 10 to 90% value - 0.5 -m s t f output signal fall time c l = 100 pf; 90 to 10% value - 0.5 -m s f t operating tooth frequency for both rotation directions t= - 40 to +85 c 0 - 2500 hz d in 0 hz sensing distance in initial mode for signals > 0 hz see fig.13 0 to 2.5 0 to 2.9 - mm d in 1 hz sensing distance in initial mode for signals > 1 hz see fig.13 0 to 3.5 0 to 3.9 - mm d dir sensing distance for safe direction detection see fig.13 0 to 3 0 to 3.4 - mm d act sensing distance in active mode see fig.13 0 to 4 0 to 4.5 - mm d in 0 hz duty cycle in initial mode for signals > 0 hz t= - 40 to +85 c; see fig.5 20 50 80 % d in 1 hz duty cycle in initial mode for signals > 1 hz t= - 40 to +85 c; see fig.5 20 50 80 % d act duty cycle in active mode t = - 40 to +85 c; see fig.5 40 50 60 %
2000 sep 04 4 philips semiconductors objective speci?cation rotational speed sensor for extended air gap application and direction detection kmi22/1 functional description the kmi22/1 is sensitive to the motion of ferrous gear wheels. the functional principle is shown in fig.3. due to the effect of flux bending the different directions of magnetic field lines in the magnetoresistive sensor element will cause an electrical signal. because of the chosen sensor orientation and the direction of ferrite magnetization the kmi22/1 is sensitive to movement in the y direction in front of the sensor only (see fig.2). the kmi22/1 contains a magnetoresistive sensor element and two ics: a position detector ic (pdic) and a line driver ic (ldic). the sensor signal is fed into the pdic which converts the signal to the digital domain, applies digital compensation and additional processing. the ldic contains three current sources (one constant, two switchable), a voltage control unit and a level shifter to provide the signal v in to the pdic (see fig.4). the digital output from the device is the combination of the speed pulse and an 8-bit data protocol. h andbook, halfpage y z xx ic sensor magnet with direction of magnetization mbk767 fig.2 component detail of the kmi22/1. handbook, full pagewidth gear wheel magnet magnetic field lines (a) (b) (c) direction of motion (d) mra957 sensor y z fig.3 functional principle.
2000 sep 04 5 philips semiconductors objective speci?cation rotational speed sensor for extended air gap application and direction detection kmi22/1 handbook, full pagewidth mbl235 sum point digital protocol unit on-chip oscillator level shifter smart comparator offset cancellation offset cancellation fc = 0 hz fc = 0 hz adjustable amplifier sensor digital control unit voltage control switchable current source v cc v in constant current source switchable current source v - fig.4 block diagram. figure 5 shows the digital compensation function in algorithmic format. after power on the sensor system is running in initial mode 0 hz. the sensor signal is preamplified but not offset compensated. the output signal represents the specified sensing distances (see chapter characteristics) for every tooth of the wheel, totally speed independent. when d in 0 hz 1 hz fs > 1 hz fs < 1 hz initial mode 1 hz active mode compensation mode fig.5 pdic function algorithm.
2000 sep 04 6 philips semiconductors objective speci?cation rotational speed sensor for extended air gap application and direction detection kmi22/1 output signal the output signal is shown in fig.6. the signal contains a speed signal and an 8-bit protocol following the speed signal. this serial transmission, using the manchester code to encode the bits, is realized by modulating the 3-level output current of the sensor system. a short pulse of the highest current level i sh represents the gear wheel structure, whereas the protocol bits are coded by using the protocol current level i ph . de?nition of the protocol data bit value figure 7 shows the definition of the protocol data bit value. the protocol data bit has the bit length t d . it is split into two half signal parts by the current edge in the middle of the data bit. data bit high is defined by the rising current edge from i l to i ph . data bit low is defined by the falling current edge. any data bit without a current edge at its middle is invalid. handbook, full pagewidth sensor output signal and hysteresis of comparator modulated output current of electronics i ph i sh + hyst 0 - hyst i l t p t mbl233 time fig.6 output signal. d t p t --- - 100% =
2000 sep 04 7 philips semiconductors objective speci?cation rotational speed sensor for extended air gap application and direction detection kmi22/1 timing of the data the data timing is shown in figs 8 and 9. o peration at normal speed the wheel speed pulse is generated whenever a rising or falling edge of the wheel signal is detected. the pulse length is t s . following the wheel speed pulse a pre-bit is sent. it is always low and has the length t p . after the pre-bit the sensor logic begins to transfer the data protocol bits. the data protocol transferred by the sensor logic consists of 9 data bits (8 data bits and a parity bit; see table 3). the data bit is length t d and must contain a current edge its middle. following the data protocol bits an end bit with length 0.5 t d is transferred. the end bit is always low, switching the current output to i l until the arrival of the next wheel speed pulse leading edge. handbook, halfpage protocol bit = low current time i ph i l i ph i l protocol bit = high t d t d 2 mbl232 fig.7 definition of protocol data bit value. handbook, full pagewidth mbl230 high pre-bit = low wheel speed pulse time high low high high low high low high t d t p t d t d t d t d t d t d t d t d t d db0 db1 db2 db3 db4 db5 db6 db7 parity i ph i sh i l t w fig.8 timing diagram of data protocol at normal wheel speed.
2000 sep 04 8 philips semiconductors objective speci?cation rotational speed sensor for extended air gap application and direction detection kmi22/1 o peration at very low speed handbook, full pagewidth mbl231 high pre-bit = low pseudo wheel speed pulse time high low high high low high low high t d t p t d t d t d t d t d t d t d t d t d db0 db1 db2 db3 db4 db5 db6 db7 parity i ph i sh i l t 2 fig.9 timing diagram of data protocol at very low speed. in the event that no wheel speed pulse is detected during time t 2 the protocol transfer is executed as described previously, except that a pseudo wheel speed pulse with protocol level high of i ph instead of i sh is substituted for the wheel speed pulse (see fig.9). t iming at high speed the pulse width of data bits t d is fixed, whereas the time interval between wheel speed pulses is not. the higher the speed of the wheel, the shorter the period t w , therefore not all data bits can be transferred at high wheel speed. in this situation, calculations are made based on the current wheel speed pulse interval (n) to determine how many will fit into this window. this data is then used to determine the number of data bits that will be transferred during the next wheel speed pulse interval (n + 2), as shown in table 1. during time interval n + 2 the sensor current output consists of the wheel speed pulse, pre-bit, data bits (less than 9 bits; see table 1), and the end bit data. referring to table 1 it can be seen that the minimum number of data bits that will be transferred during period n + 2 is 2. if 3 or less data bits are to be transferred, the end bit length will be reduced to 0. table 1 calculation of the number of protocol bits maximum number of t d in the current time interval n (t w ) protocol bits for time interval n + 2 <5 2 53 64 75 86 97 10 8 >10 8
2000 sep 04 9 philips semiconductors objective speci?cation rotational speed sensor for extended air gap application and direction detection kmi22/1 p ulse and protocol definitions table 2 pulse and protocol timing t amb = - 40 to +85 c; v cc = 12 v; test circuit: see fig.12; r l =43 w ; unless otherwise speci?ed. table 3 de?nition of data bits notes 1. air gap reserve: this bit of the protocol indicates that the processed signal amplitude is smaller than twice the minimum allowed signal amplitude (see fig.10). if this bit is flagged then the air gap is nearly used up, which means that the sensor system will stop working for a further reduction of the signal amplitude. 2. correct direction recognition is guaranteed for sensing distance: see chapter characteristics. 3. bits sd0 to sd2: these bits are used to quantify the signal amplitude and therefore the air gap can be divided into 8 sections (see fig.10). for a temperature sweep over the complete specified range the air gap information may change by 2 lsbs due to the temperature coefficient of the sensor signal amplitude. symbol parameter conditions min. typ. max. unit t s speed signal pulse width see figs 8 and 9 40 50 60 m s t p pre-bit pulse width see figs 8 and 9 20 25 30 m s t d data pulse width see figs 8 and 9 40 50 60 m s t 2 time between pseudo speed pulses see fig.9 120 150 180 ms data bit symbol description remark 0 ar air gap reserve logic 1 when distance too large; note 1 1 m mode state logic 1 when in initial mode, 0 when in active mode 2v in digital input state logic 1 when v in = low; default 3 vdr validity direction recognition logic 1 when direction bit is valid; note 2 4 dr direction recognition logic 1 when direction is positive (see fig.10) 5 sd0 sensing distance bit 0 re?ects actual sensing distance; lsb; note 3; fig.10 6 sd1 sensing distance bit 1 re?ects actual sensing distance; note 3; fig.10 7 sd2 sensing distance bit 2 re?ects actual sensing distance; msb; note 3; fig.10 8 p parity high for even parity: p = xor (data 0, data 1 to data 7)
2000 sep 04 10 philips semiconductors objective speci?cation rotational speed sensor for extended air gap application and direction detection kmi22/1 handbook, full pagewidth 0 20406080100 10 2 10 1 mbl229 air gap between sensor and target (%) protocol bit 0: air gap reserve = 1 sensor amplitude (%) protocol bits 5 to 7: air gap measurement (msb first) 111 110 101 100 011 010 001 000 fig.10 sensor amplitude versus air gap. mounting conditions the recommended sensor position in front of a gear wheel is shown in fig.13. the distance d is measured between the sensor front and the tip of a gear wheel tooth. the kmi22/1 senses ferrous indicators like gear wheels in the y direction only (no rotational symmetry of the sensor); see fig.2. the symmetrical reference axis of the sensor corresponds to the axis of the ferrite magnet. table 4 gear wheel dimensions note 1. for conversion from asa to din: m = 25.4 mm/dp; p = 25.4 mm cp. symbol description unit german din z number of teeth d diameter mm m module m = d/z mm p pitch p =p mmm asa; note 1 pd pitch diameter (d in inches) inch dp diametric pitch dp = z/pd inch - 1 cp circular pitch cp = p /dp inch
2000 sep 04 11 philips semiconductors objective speci?cation rotational speed sensor for extended air gap application and direction detection kmi22/1 handbook, halfpage pitch pitch diameter mra964 fig.11 gear wheel dimensions. pitch = module p module pitch diameter number of teeth ------------------------------------------- = mbl234 v cc r l c l v in v - sensor gnd i cc fig.12 test and application circuit. handbook, halfpage gear wheel sensor d d mra963 fig.13 sensor positioning. centre die position: see chapter package outline. handbook, halfpage module m (mm) 1 0.5 1.5 0 0 12 3 4 5 d mra966 d 0 fig.14 normalized maximum sensing distance as a function of gear wheel module; typical values. d 0 = measuring distance for a gear wheel with module m = 2 mm.
2000 sep 04 12 philips semiconductors objective speci?cation rotational speed sensor for extended air gap application and direction detection kmi22/1 emc figure 15 shows a recommended application circuit for automotive applications. it provides a protection interface to meet electromagnetic compatibility (emc) standards and safeguard against voltage spikes. table 5 lists the tests which are applicable to this circuit and the achieved class of functional status. protection against load dump (test pulses 5 according to din 40839 ) means a very high demand on the protection circuit and requires a suitable suppressor diode with sufficient energy absorption capability. the board net often contains a central load dump protection that makes such a device in the protection circuit of the sensor module unnecessary. tests for electrostatic discharge (esd) were conducted in line with iec 801-2 to demonstrate the kmi22/1s handling capabilities. the iec 801-2 test conditions were: c = 150 pf, r = 150 w , v = 4 kv. electromagnetic disturbances with fields up to 150 v/m and f = 1 ghz (ref. din 40839 ) have no influence on performance. table 5 emc test results emc ref. din 40839 symbol min. (v) max. (v) remarks class test pulse 1 v ld - 100 - t d = 2 ms c test pulse 2 v ld - 100 t d = 0.2 ms a test pulse 3a v ld - 150 - t d = 0.1 m sa test pulse 3b v ld - 100 t d = 0.1 m sa test pulse 4 v ld - 7 - t d = 130 ms b test pulse 5 v ld - 120 t d = 400 ms b handbook, full pagewidth mgt534 c l r l c1 43 w 100 nf 100 nf d2 d1 bzto3g36 1n4001/3 + v gnd - v v cc sensor fig.15 emc: test and application circuit.
2000 sep 04 13 philips semiconductors objective speci?cation rotational speed sensor for extended air gap application and direction detection kmi22/1 package outline unit b p c q l 2 l 1 v references outline version european projection issue date iec jedec eiaj mm 1.7 1.4 0.8 0.7 b p1 1.57 1.47 5.7 5.5 4.1 3.9 0.3 0.24 1.2 0.9 3.9 3.5 m 1 8.15 7.85 m 2 8.15 7.85 m 3 (1) 4.7 4.3 l 7.55 7.25 d (2) d 1 (2) 4.5 4.3 e (2) 5.7 5.5 4.6 4.4 e 1 (2) 18.2 17.8 h e 5.6 5.5 h e1 k max. 5.37 e 2.35 2.15 e 1 0.25 0.75 0.65 dimensions (mm are the original dimensions) sot477b 99-09-23 00-08-31 0 2.5 5 mm scale a (1) plastic single-ended multi-chip package; magnetized ferrite magnet (8 x 8 x 4.5 mm); 4 interconnections; 3 in-line leads sot477b e 123 e 1 e e 1 h e1 l 1 d l b p1 d 1 sensor die position * centre of reading point h e m 1 l 2 b p c v m ab q v m ab a k m 2 m 3 b a notes 1. glue thickness not included. 2. plastic or metal protrusions of 0.15 mm maximum per side are not included.
2000 sep 04 14 philips semiconductors objective speci?cation rotational speed sensor for extended air gap application and direction detection kmi22/1 data sheet status note 1. please consult the most recently issued data sheet before initiating or completing a design. data sheet status product status definitions (1) objective speci?cation development this data sheet contains the design target or goal speci?cations for product development. speci?cation may change in any manner without notice. preliminary speci?cation quali?cation this data sheet contains preliminary data, and supplementary data will be published at a later date. philips semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. product speci?cation production this data sheet contains ?nal speci?cations. philips semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2000 sep 04 15 philips semiconductors objective speci?cation rotational speed sensor for extended air gap application and direction detection kmi22/1 notes
? philips electronics n.v. sca all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. internet: http://www.semiconductors.philips.com 2000 70 philips semiconductors C a worldwide company for all other countries apply to: philips semiconductors, marketing communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 3 figtree drive, homebush, nsw 2140, tel. +61 2 9704 8141, fax. +61 2 9704 8139 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 4099 6161, fax. +33 1 4099 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, via casati, 23 - 20052 monza (mi), tel. +39 039 203 6838, fax +39 039 203 6800 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5057 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381, fax +9-5 800 943 0087 middle east: see italy netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 pakistan: see singapore philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland : al.jerozolimskie 195 b, 02-222 warsaw, tel. +48 22 5710 000, fax. +48 22 5710 001 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 58088 newville 2114, tel. +27 11 471 5401, fax. +27 11 471 5398 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 5f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2451, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 60/14 moo 11, bangna trad road km. 3, bagna, bangkok 10260, tel. +66 2 361 7910, fax. +66 2 398 3447 turkey: yukari dudullu, org. san. blg., 2.cad. nr. 28 81260 umraniye, istanbul, tel. +90 216 522 1500, fax. +90 216 522 1813 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 208 730 5000, fax. +44 208 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 800 943 0087 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 3341 299, fax.+381 11 3342 553 printed in the netherlands 613520/01/pp 16 date of release: 2000 sep 04 document order number: 9397 750 07247


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